On-chip antenna-integrated 300 GHz-band 2D phased-array transceiver IC developed

We have succeeded in realizing a two-dimensional phased-array transceiver capable of wireless communication in the terahertz band, implemented entirely in a CMOS integrated circuit — including the antennas and the bi-directional transmit/receive circuitry.

This achievement was presented at the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits, held in Honolulu, USA, from June 14 to 18.

Key points

• Realized a 300 GHz-band 2D phased-array transceiver using a low-cost, mass-producible CMOS integrated circuit
• Achieved the world’s first integration of a 300 GHz half-wavelength-spaced 2D 4×4 antenna array together with bi-directional phased-array transmit/receive circuitry on a single all-CMOS chip
• Demonstrated an ultra-low-power, low-cost IC, accelerating the implementation of terahertz-band wireless communication in 6G